Technologies
The Ma.Vi. laboratory is equipped to cover the entire development cycle of an electronic system: from schematic design and PCB layout through to firmware, simulation and mechanical packaging. Every phase is managed in-house, with professional tools and expertise built up over time.
Below are the main technological areas in which we operate, along with the environments and methodologies used daily in our projects.
01
Electronic schematic design for every type of application: embedded systems, analogue and digital circuits, industrial and commercial applications. From the first functional specification through to the final revision, every schematic is developed with attention to clarity, testability and consistency with production requirements.
02
Multilayer PCB layout with SMD and THD components on any type of substrate, applying the latest production technologies. Impedance control and electromagnetic compatibility management are an integral part of the design process, ensuring reliability and compliance from the very first prototype.
03
Management of electronic component libraries complete with accurate 3D models, enabling footprint verification and PCB integration into mechanical enclosures from the earliest stages of the project. This approach reduces iterations between electronics and mechanics, anticipating critical issues before the production phase.
04
Multi-platform and multi-language firmware development environment, suited to projects requiring code portability or the use of multiple toolchains in parallel. The flexibility of the environment allows support for different architectures within the same project, from rapid prototyping through to production release.
05
Development software dedicated to the STM32 microcontroller family, with consolidated expertise in peripherals, RTOS and resource optimisation. From hardware configuration through to application firmware, we support the client at every stage of the development cycle on ST-Microelectronics targets.
06
Programmable logic development on Intel FPGAs with Quartus Prime, from RTL architecture to timing analysis. Our experience covers signal processing applications, industrial bus interfacing and high-speed communication management, with a focus on the reusability of developed IP blocks.
07
Integration of SPICE simulation into the analogue design flow, using dedicated libraries to predict circuit behaviour before physical realisation. This approach enables identification of critical issues and optimisation of design choices in the early stages, reducing the number of hardware revisions and accelerating time to market.
08
Design of custom mechanical enclosures using 3D printing for rapid prototyping, CNC machining for the customisation of commercial packaging, and the production of folded steel and aluminium enclosures. Every solution is developed in close integration with the electronic design, ensuring a final product that is coherent both functionally and aesthetically.