Compact two-board systems integrating a high-power-density 12 kW H-bridge with a mixed-signal carrier board. Communication is handled via the EtherCAT protocol, and a piggyback module with a Zynq processor manages real-time control. The physical separation between the power section and the control section ensures optimal isolation, reduced footprint, and ease of field maintenance.

VME bus designs for signal processing applications requiring high computational power. The dual Cyclone FPGA allows division of functions for signal management and bus communication, alongside a dedicated DSP processor for intensive numerical algorithms. The mechanical front panel is custom-made to ensure full accessibility to field connections.

A complete range of modules for distributed I/O based on the EtherCAT protocol: analogue inputs, analogue outputs, encoder reading and digital I/O. Each module is designed to integrate natively into existing control systems, ensuring deterministic synchronisation and sub-millisecond latency for real-time applications.

Enclosures with customisable silkscreen, designed for applications requiring structural lightness and clear visual identification. The folded manufacturing process ensures dimensional precision and repeatability, with the option to apply logos, functional labels and markings according to client specifications.

Quality-finish enclosures with full customisation of labels and silkscreen. Designed for installations where the visual identity of the final product is an integral part of the project, they offer a robust and refined housing for custom-developed electronics.

Design of analogue-digital signal boards for industrial environments with high electromagnetic interference, featuring high-speed communication via fibre optics. The piggyback module integrates a MicroZed SoM and a Cyclone FPGA, where programmable logic manages critical data paths in real time while the ARM processor supervises communication and control functions.

Mezzanine card module with PCI bus and dual fibre-optic channel, providing high-speed communications with intrinsic galvanic isolation. The mezzanine form factor allows direct integration on compatible carrier boards, maintaining a reduced footprint and simplifying cabling in embedded and industrial systems.

An expandable modular system composed of a central CPU with serial, Ethernet and USB connectivity, paired with a drive board featuring analogue current and voltage acquisition, digital I/O, and additional serial and digital I/O expansion boards. The modular architecture allows the system to be configured around actual application requirements and expanded over time without redesigning the entire platform.

Steel or brushed aluminium enclosures designed for mounting on Omega DIN rails. Internal heat sinks and calibrated ventilation openings for natural convection cooling are available. The absence of moving parts maximises reliability in continuous operation, making them suitable for electrical panels and industrial environments where maintenance must be minimised.